Lateral etching processes for the modeling of the geometry of self-formation nanostructures with Silvaco TCAD Athena program are analyzed. Self-formation nanostructures is modeled with different mask selectivity values equal to 2, 10, 40 and 100 with respect to the etching layer, with the etching duration of
0–180 s. The etching rates are constant – 1.33 nm/s. The analysis of the dependence of the etching systematic error on its thickness has been carried out. The computer modeled results are close to the ones produced by means of the application of the analytical calculation models by other authors.

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